Xi'an LongSource Electronics Technology Co.,Ltd

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Xi’an LongSource Electronics Technology Co.,Ltd is a professional semiconduct manufacture.The company designs, manufactures and markets precision tools, assembles and consumable parts that are used for manufacture and test semiconductors. We have a professional management team and a group of engineers and technicians,which form a strong team for R&D,production control,quality assurance,sales and service system,especially our management staffs,technicians and engieers have not only good professional knowledge, but also abundant experience in this industry filed----Manufacture and ...

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Toshiba introduces optocoupler with built-in prote By changing the size of the external complementary MOSFET buffer, tlp5231 can provide the required gate current for various IGBTs and MOSFETs. Tlp5231, MOSFET b... Details>: Eight industry leaders work together to speed pluggable tran; Enter the technology entrepreneur, trade Ze e-sponsored the; E-alliance launches top anti-static products selected by exp; New product recommendation of tradeze Electronics: February; Vishay's new automotive grade optotransistor coupler saves e; Molex releases custom cable generator; Ampere introduces the industry's first 80 core server proces; Silicon labs new secure vault technology redefines IOT devic

Purple light shares in Sunmoon Suzhou company, sea Sunmoon investment control announced on August 10 that the subsidiary J R Holding Limited disposed of 30% equity of Suzhou Riyuexin to Ziguang group, with a tra... Details>: Save valuable resources of evald-c5160; Nordic nrf52833 multi protocol SOC; About IC package, you know or don't know here; 5g chip era, optimistic about these two kinds of packaging; Dip / BGA / SMD and other common chip packaging type summary; Taiwan's large factories account for 90% of the profits. How; Cooperation and win-win cooperation in China; Challenges faced by sealing and testing plants

Memory seal testing plant Licheng technology inves At the end of September, Li Chengcai invested NT $50 billion (US $1.615 billion) to build the first state-of-the-art panel level fan-out sealing and testing (fo... Details>: Memory seal testing plant Licheng technology invested 1.6 bi; Huaxin micro plans to invest 2.5 billion in Nanning to build; How should Taiwan manufacturers cope with the strong rise of; What does TSMC want to do; Anti blocking packaging technology; The world's first 12 inch 3D TSV wafer level packaging line; Huatian technology's silicon-based fan out packaging technol; Innovation in SiC technology and packaging helps overcome au

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